| https://www.eptac.com/ask/maximum-limits-of-solder-bath-contamination/
Maximum Limits of Solder Bath Contamination - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/maximum-limits-of-solder-bath-contamination
Maximum Limits of Solder Bath Contamination - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint? Question
| https://www.eptac.com/faqs/ask-helena-leo/ask/cutting-solder-joints-not-during-lead-trimming
“shave” the lumps off with an Exacto knife? This is something I’ve never seen before and I couldn’t find any criteria on cutting solder joints except for when you are lead cutting, which I know when you do, you are not supposed to cut into the solder joints. Answer
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
Are Voids in Solder Joints Really an Issue? - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| http://etasmt.com/cc?ID=te_news_bulletin,19361&url=_print
. Remove metal oxides and certain contamination from the metal and solder particles to be bonded. 3. When the temperature continues to rise, the solder particles first melt separately and begin the process of liquefaction and begin to form solder joints. 4
| http://etasmt.com:9060/te_news_bulletin/2020-09-19/19361.chtml
. Remove metal oxides and certain contamination from the metal and solder particles to be bonded. 3. When the temperature continues to rise, the solder particles first melt separately and begin the process of liquefaction and begin to form solder joints. 4
| http://etasmt.com/te_news_bulletin/2020-09-19/19361.chtml
. Remove metal oxides and certain contamination from the metal and solder particles to be bonded. 3. When the temperature continues to rise, the solder particles first melt separately and begin the process of liquefaction and begin to form solder joints. 4
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