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. The microstructure makes up both electrical and physical connections. Changes can limit the devices useful life. In addition to the microstructure, there are many factors contributing to electrochemical failures on electronic devices including pitch, electrical field, ionic contamination and environmental conditions
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: We assemble simple through hole circuit boards. What are the main factors to consider when shifting from hand soldering to wave soldering
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: Manual Soldering vs Wave Soldering Question: We assemble simple through hole circuit boards. What are the main factors to consider when shifting from hand soldering to wave soldering
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. Therefore, any SMT production line has certain pertinence, such as the speed and price of the SMD reflow oven are different, there are many other factors
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. There are many factors that affect the board’s ability to warm up accurately. The major factors are: Initial PCB temperature In most of situations, the initial PCB temperature is the same as room temperature
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process, the creation of the perfect solder joint. So many factors enter into this process, but there is one that is constantly discussed in every specification and standard, that even though we do not see it with the unaided eye, is critical to
