| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_simultaneously-generate-l-n-and-m-density_topic2492.xml
designs.I normally only use the N but in some portable instruments where space is tight I may make the decision to go down to L.Generally I use M for those boards where there's a high likel hood that they are going to be hand-soldered as a prototype/development board or even a production board where only a handful are going to
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/simultaneously-generate-l-n-and-m-density_topic2492_post10271.html
. I normally only use the N but in some portable instruments where space is tight I may make the decision to go down to L. Generally I use M for those boards where there's a high likel hood that they are going to be hand-soldered as a prototype/development board or even a production board where only a handful are going
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
] gold thickness and all through-hole leads that will be hand soldered regardless of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
] gold thickness and all through-hole leads that will be hand soldered regardless of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-design-in-the-1970s_topic2333.xml
. The solder mask swell was between 0.20 mm (8 mil) and 0.25 mm (10 mil)annular ring. We were not concerned about solder bridging because the through-holecomponents were hand soldered
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/simultaneously-generate-l-n-and-m-density_topic2492_post10269.html
. I normally only use the N but in some portable instruments where space is tight I may make the decision to go down to L. Generally I use M for those boards where there's a high likel hood that they are going to be hand-soldered as a prototype/development board or even a production board where only a handful are going
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2492&OB=DESC.html
. I normally only use the N but in some portable instruments where space is tight I may make the decision to go down to L. Generally I use M for those boards where there's a high likel hood that they are going to be hand-soldered as a prototype/development board or even a production board where only a handful are going
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2492&OB=ASC.html
. I normally only use the N but in some portable instruments where space is tight I may make the decision to go down to L. Generally I use M for those boards where there's a high likel hood that they are going to be hand-soldered as a prototype/development board or even a production board where only a handful are going
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