124 hard gold stain results

Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/gold-removal-issues-with-hollow-cup-connectors/

: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector

Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/gold-removal-issues-with-hollow-cup-connectors

: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed/

J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

universal 8mm dual lane DL-60 gold plus feeders 49889210/49889212/49889213/49889214/49889215/4988921

| https://www.hitachi-feeder.com/sale-10531301-universal-8mm-dual-lane-dl-60-gold-plus-feeders-49889210-49889212-49889213-49889214-49889215-4988921.html

8MM TAPE GUIDE 550C-014 HARD DECK INSERT 80052207 SOCKET HEAD CAP, 2.5 X 6 12mm High Performance (Gold Plus) Spliceable Tape Feeder 50934804/50934805/50934806/50934807 0741C-0111 REEL PIN 0931A-0013 12MM FIXED TAPE WINDOW ASSY 0931A-0018 12MM FIXED TAPE

Interesting Customer Questions Topics of Customer Questions • Gold plating vs Gold Flash • Gull Wing Toe Fillet requirements • Class 3 rework • Tempered leads, what are they

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

The Need For Gold Removal On Solderable Surfaces 2 The Criteria J-STD-001 – 4.5.1 Gold Removal •  Gold Shall Be Removed: N1P2D3 –  From at least 95% of the surfaces to be soldered of the through-hole component leads with

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

. •  The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix. 12 Gold Embrittlement 13 Gold Embrittlement The data presented in these figures are from a theoretical calculation and have not been tested in practice but should be useful as a guide to avoiding

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

Lighting & LED Plasma Treatment | Nordson MARCH

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/lighting-and-led?con=t&page=2

Nordson MARCH Bonding Strengths at Plastic Encapsulent−Gold-Plated Copper Leadframe Interface Nordson MARCH Preventing Adhesive Resin Bleed in Microelectronics Assembly Through Gas Plasma Technology Nordson MARCH First

ASYMTEK Products | Nordson Electronics Solutions