ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/about/blog/heated-stage
. Die Heated Stage bietet einen weiteren Einblick, um die Defektbildung während des Reflows zu verstehen, indem man sie sieht, während sie passiert. Head in Pillow Einer der am
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/blog/heated-stage
. Head-in-pillow One of the most commonly looked for defects is Head-In-Pillow or HIP. Often seen in Ball Grid Array (BGA) device connections post reflow, where the BGA ball and solder paste on the PCB pad do not form a cohesive joint
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/explorer-one
. Inspecting boards from every side is important to catch head in pillow defects, observe component cracking and to clearly see PTH solder fill level
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/wafer-inspection-and-metrology
. Finden Sie Defekte wie kalte Verbindungen, Head in Pillow und Ausrichtungsfehler in 2,5D- und 3D-Gehäusen auf Waferebene. Quadra 7 ist eine vielseitige, laborbasierte Lösung
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/products/wafer-x-ray-metrology
Gaseinschlüsse von Bumps auf dem Wafer. Finden Sie Defekte wie kalte Verbindungen, Head in Pillow und Ausrichtungsfehler in 2,5D- und 3D-Gehäusen auf Waferebene. Quadra 7 ist eine vielseitige, laborbasierte
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/wafer-inspection-and-metrology
. Find defects such as cold joints, head in pillow and misalignment in 2.5D and 3D wafer level packages. Quadra 7 is a versatile, lab based solution for wafer level inspection offering industry leading magnification and image quality
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/products/x-ray-inspection-systems/quadra-w8-x-ray-inspection
. Finden Sie Defekte wie kalte Verbindungen, head-in-pillow und Fehlausrichtung in 2,5D- und 3D-Gehäusen auf Waferebene. Das integrierte Wafer-Handling stellt sicher, dass die Bediener die
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dages-peter-koch-to-discuss-failure-analysis-with-xray-at-epps-innovations-forum
. Koch will discuss failures on BGAs, HiP (Head-in-Pillow) defects, cracks and simple failures such as solder bridges. Most of these failures can be detected with 2D inspection
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/peter-koch-of-nordson-dage-will-discuss-failure-analysis-with-x-ray-at-eteks-technology-event
“Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.” Mr. Koch will discuss failures on BGAs, HiP (Head in Pillow) defects, cracks and simple failures such as solder bridges
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/quadra-w8-x-ray-inspection
& adhesive voiding during MEMS manufacture. Check for bump presence, shape, position and voiding in wafer bumps. Find defects such as cold joints, head in pillow and misalignment in
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