24 ipc hard gold plating spec results

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/

: We have a situation where we have gold boards which accept gold wire bonding, but are failing a pull test. Other than making sure the boards are clean with a quick trip into the degreaser, is there any other way to refresh gold plating to help these boards pass pull testing

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post9030.html

.    Standard Spec Boards (PCB's) are inspected to IPC Class 2  Standards and  Custom Spec Boards are inspected to either IPC Class 2 or Class 3  depending on the option to be chosen

PCB Libraries, Inc.

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html

.    Standard Spec Boards (PCB's) are inspected to IPC Class 2  Standards and  Custom Spec Boards are inspected to either IPC Class 2 or Class 3  depending on the option to be chosen

PCB Libraries, Inc.

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html

.    Standard Spec Boards (PCB's) are inspected to IPC Class 2  Standards and  Custom Spec Boards are inspected to either IPC Class 2 or Class 3  depending on the option to be chosen

PCB Libraries, Inc.

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post3186.html

.    Standard Spec Boards (PCB's) are inspected to IPC Class 2  Standards and  Custom Spec Boards are inspected to either IPC Class 2 or Class 3  depending on the option to be chosen

PCB Libraries, Inc.

IPC Standards for Manufacturing & Assembly - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic877&OB=ASC.html

and Flexible Adhesive Bonding Films IPC-4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 - Specification for Eletroless Nickel/Immersion Gold (ENIG

PCB Libraries, Inc.

Interesting Customer Questions Topics of Customer Questions • Gold plating vs Gold Flash • Gull Wing Toe Fillet requirements • Class 3 rework • Tempered leads, what are they

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

– IPC/ WHMA-A-620 7 The Criteria J-STD-001 Rev E •  The (a) information in 620 is based upon Rev E 8 The Criteria – NASA – 8739.3 •  7.2.5 c - Gold plating on all surfaces that become part of finished solder connections shall be removed by two or more successive tinning operations (solder pot or iron

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

– IPC/ WHMA-A-620 4 The Criteria – NASA – 8739.3 •  7.2.5 c - Gold plating on all surfaces that become part of finished solder connections shall be removed by two or more successive tinning operations (solder pot or iron

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

Soldertips

| https://www.eptac.com/faqs/soldertips?hsLang=en

. Read More Gold Removal Issues with Hollow Cup Connectors General Tip Question: We are having a hard time with the removal of gold from hollow cup connectors