GPD Global | https://www.gpd-global.com/fluiddispense-appsol-wafer.php
Pumps for Wafer Dispensing: Underfill, Edge Sealing, MEMS Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
GPD Global | https://www.gpd-global.com/pumps-wafer-dispensing-mems.php
Pumps for Wafer Dispensing: Underfill, Edge Sealing, MEMS Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/improve-productivity-jet-underfill-into-narrow-gaps-fast
Improve Productivity - Jet Underfill into Narrow Gaps Fast ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
KingFei SMT Tech | https://www.smtspare-parts.com/sale-8530620-second-hand-x-series-siemens-feeder-single-8mm-00141270-00141290.html
Second Hand X Series Siemens Feeder Single 8mm 00141270 00141290 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/news/demonstrates-dual-action-underfill-nepcon-china-2013
Nordson ASYMTEK Demonstrates Dual-Action Underfill at NEPCON China Booth #1F61 ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/zh-CN/divisions/asymtek/about-us/news/demonstrates-dual-action-underfill-nepcon-china-2013
Nordson ASYMTEK Demonstrates Dual-Action Underfill at NEPCON China Booth #1F61 ASYMTEK Products 公司首页 | 全球目录 | 语言 唯一部门 所有诺信公司 点胶 点胶系统 喷射点胶头及点胶阀 表面涂覆 表面涂覆系统 涂覆头 固化 工艺过程 胶体类型 市场与行业 应用角 视频资料库 技术支持 培训 文献库 在线商店 关于我们 新闻 市场活动 企业概况 可持续发展及安全 质量体系 & ISO标准 9001
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/customer-success-story-with-nexjet-8
Customer Success Story, Underfill, NJ-8, DJ-9500, upgrading,mobile phone flex circuit, industry, automotive, Nordson Asymtek, jet, dispensing, UPH improvement ASYMTEK Products Corporate | Global Directory
| http://etasmt.com/cc?ID=te_news_bulletin,14961&url=_print
. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
| http://etasmt.com/te_news_bulletin/2020-03-28/14961.chtml
. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
| http://etasmt.com/cc?ID=te_news_industry,24361&url=_print
(usually no more than 2ºC/second - check solder paste datasheet). Heating too quickly can cause defects such as components to crack and the solder paste to splatter causing solder balls during reflow. Soak
