Industry Directory: flip chip alignment (Page 1 of 6)

Precision PCB Services, Inc

Precision PCB Services, Inc

Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

FlipChips Dot Com

Industry Directory |

A free dedicated, neutral site for flip chip information, including technical articles, tutorials, technology updates, and qualified suppliers.

STATS ChipPAC Inc

Industry Directory | Other

STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets.

Eclipse Industries

Industry Directory |

Eclipse Industries manufactures the ultra-high precision DS-107 Aligner Bonder, alignment to 1-2 microns, bond force 5 gm to 100 kg. Applications are flip chip, die bonding, CSP, uBGA, MCM, flat panel displays, die-to-wafer & optoelectronics.

Semiconductor Equipment

Industry Directory |

Semiconductor Equipment Corporation designs and manufactures flip chip placement and

WORLD Electronics

Industry Directory | Manufacturer

SMT,COB,FLIP CHIP,MCM Assembly. Prototype thru Production.

MeltroniX Inc

Industry Directory |

MeltroniX Inc provides advanced microelectronics packaging services to the elecvtronics sector. Processes include chip and wire, flip chip, wafer bumping, SMT, and complete hybrid/MCM fabrication.

Compeq manufacturing co; LTD.

Industry Directory | Manufacturer's Representative

1-High layer count PCB manufacturer. 2-Flip chip plastic substrate manufacturer.

Waterfall Technologies

Industry Directory |

SMT Training programs , Hands-on Assembly line problem solving, yield improvement, consulting and process development. Flip Chip evaluation kits & Lab services

Kyocera America, Inc.

Industry Directory | Manufacturer

Ceramic and organic packaging and package assembly. Flip Chip, Wirebond, Lidding for a wide range of devices and applications from power semiconductors, ASICs, to complex modules.

  1 2 3 4 5 6 Next

flip chip alignment searches for Companies, Equipment, Machines, Suppliers & Information

2024 Eptac IPC Certification Training Schedule

High Throughput Reflow Oven
Software for SMT

Best Reflow Oven
PCB separator

Original SMT Feeders and spares for Panasonic, Fuji , Yamaha, Juki , Samsung