Technical Library: assembly calculation (Page 1 of 1)

What Does Industry 4.0 Actually Deliver Today? Example Reflow.

Technical Library | 2021-08-04 18:41:30.0

Industry 4.0 is one of the most exciting developments in the manufacturing industry in decades. It promises vast improvements for both manufacturers and their customers. For some companies, however, it can be overwhelming, and it can be difficult with the current available information to understand exactly what the benefits will be in the average factory, and to calculate the return on the investment. Therefore, it may be helpful to bring the discussion down to a tangible level and to isolate one little part of the whole smart electronic assembly factory, namely reflow.

KIC Thermal

Optimizing Flip Chip Substrate Layout for Assembly

Technical Library | 2007-11-29 17:20:31.0

Programs have been developed to predict the expected yield of flip chip assemblies, based on substrate design and the statistics of actual manufactured boards, as well as placement machine accuracy, variations in bump sizes, and possible substrate warpage. These predictions and the trends they reveal can be used to direct changes in design so that defect levels will fall below the acceptable limits. Shapes of joints are calculated analytically, or when this is not possible, numerically by means of a public domain program called Surface Evolver. The method is illustrated with an example involving the substrate for a flip chip BGA.

Universal Instruments Corporation

DPBO – A New Control Chart For Electronics Assembly

Technical Library | 2023-08-02 18:18:23.0

As six sigma (6) and better processes are demanded for higher yields and as organizations move from measuring defects in terms of parts-per-million (ppm) towards parts-per-billion (ppb), the resolution of extant control charts is becoming insufficient to monitor process quality. This work describes the development of a new statistical process control (SPC) chart that is used to monitor processes in terms of defects-per-billion-opportunities (dpbo). A logical extension of the defects-per-million-opportunities (dpmo) control chart, calculations used to derive the dpbo control limits will be presented and examples of in-control and out-of-control processes will be offered.

Binghamton University

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assembly calculation searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155

PCB Handling with CE

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
fluid dispenser

Training online, at your facility, or at one of our worldwide training centers"
Win Source Online Electronic parts

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
2024 Eptac IPC Certification Training Schedule

Reflow Soldering 101 Training Course
PCB Handling Machine with CE

Software for SMT placement & AOI - Free Download.
SMT spare parts

Thermal Transfer Materials.