Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2018-04-27 12:59:29.0
Hot Air and IR are the two main types of rework stations used by OEMs and PCB contract manufacturers today. Both have advantages and disadvantages and choosing the right one for your application requires a careful consideration of a number of factors, including your budget, your working requirements and the capabilities of your staff. In this article, we outline some of the differences between hot air and IR BGA rework stations.
Technical Library | 2023-11-25 07:46:13.0
In the dynamic realm of Surface Mount Technology (SMT), where efficiency and precision are paramount, I.C.T, a renowned SMT equipment manufacturer, proudly unveils its latest innovation – the I.C.T-910 Automatic IC Programming System. Crafted to cater to the intricate demands of SMD chip programming, this cutting-edge device vows to redefine your programming experience and elevate production capabilities. Programming system.png The Power of IC Programming System: As a beacon of excellence in IC Programming Systems, the I.C.T-910 seamlessly integrates advanced technology with user-friendly features. This system empowers manufacturers in the SMT industry, offering versatility in programming needs by accommodating a wide range of SMD chips. Precision Programming: The I.C.T-910 boasts unparalleled precision in programming SMD chips, ensuring accuracy in every generated code. In the SMT industry, where even the slightest error can lead to setbacks, this precision is indispensable. Efficiency Redefined: Accelerate your production timelines with the I.C.T-910's efficient programming capabilities. Engineered to optimize workflows, this system ensures rapid programming without compromising quality, recognizing that time is money in the SMT industry. User-Friendly Interface: Navigating the complexities of IC programming is simplified with the I.C.T-910's intuitive user interface. Operators, even without extensive programming expertise, can harness the system's power, minimizing the learning curve and maximizing productivity. Compatibility and Adaptability: The I.C.T-910 breaks free from limitations, supporting a wide array of SMD chip models. It is a versatile solution for diverse programming requirements, allowing you to stay ahead of technological advancements. Why Choose I.C.T-910 IC Programming System? 8 sets of 32-64sit burners Nozzle: 4pcs Camera: 2pcs (Component camera + Marking camera) UPH: 2000-3000PCS/H Package type: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP, and so on. Compatibility: Adapters provided based on customer products. Simple operation interface: Modular and layered interface with pictures and texts for easy operation. System upgrade: Free software upgrade service. Reliability: Trust in the I.C.T-910, a programming system that prioritizes reliability. Rigorous testing ensures consistent and dependable performance, reducing the risk of programming errors and downtime. Elevate Your Competitiveness: Incorporate the I.C.T-910 into your production line to elevate competitiveness in the market. Stay ahead with a programming system designed to meet the demands of the fast-paced SMT industry. Embrace the Future with I.C.T-910: In a landscape where precision, efficiency, and adaptability are non-negotiable, the I.C.T-910 Automatic IC Programming System emerges as the game-changer for SMT manufacturers. Revolutionize your programming processes, enhance productivity, and future-proof your operations with the I.C.T-910. Choose I.C.T-910 and stay ahead in the SMT industry, ushering in the next era of IC programming excellence.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
Technical Library | 1999-05-06 11:18:25.0
The trend toward surface-mount assembly processes is making ball-grid array (BGA) packaging a popular choice for many types of devices, forcing designers to re-examine cooling of these large packages. While devices in BGAs transfer more heat to the board than leaded devices, the style of BGA packages has a large influence on the ability to transfer heat through other pathways, such as a top-mounted heat sink. Physical characteristics of the BGA further constrain the thermal designer. It takes forethought in board design to successfully accommodate devices that require significant heat dissipation. Multiple solutions exist, however, for BGA packages of all types.
Technical Library | 2014-10-16 16:39:12.0
Key points are: *Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs * Integrity of EOL products in terms of solderability needs to be verified.
