Technical Library | 2018-10-20 13:50:05.0
With this easy-to-use Troubleshooting Guide, you can learn to troubleshoot common SMT issues. After using it a few times, it will become an essential companion for you and anyone in your company responsible for operating an SMT line. This Guide offers troubleshooting advice for common SMT assembly issues by process defect. If your issue is not resolved after following the steps to help identify the possible root cause and solution, please contact your Cookson Electronics representative who will be able to provide you with further assistance.
Technical Library | 2003-05-05 07:36:58.0
The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization.
Technical Library | 2003-04-18 12:05:57.0
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem.
Technical Library | 2014-03-27 14:32:24.0
The surface finish you select will have a large influence on quality, reliability and cost. It is a complex decision that impacts many areas of the business. Select a finish that optimal for the business (and not just one function). Know that there are engineering tricks to improve on weak areas of each finish. Stay current in this field because new developments continue to be made.
Technical Library | 2010-06-17 20:48:04.0
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process.
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