Technical Library: technology electronics (Page 1 of 18)

Are You Ready for Lead Free

Technical Library | 2023-01-17 17:37:45.0

Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates.

Heller Industries Inc.

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Technical Library | 2023-01-17 17:12:33.0

Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.

Heller Industries Inc.

Thermal Interface Material (TIM) Dispensing For Consumer Products

Technical Library | 2023-08-16 18:25:16.0

In one of our Consumer Electronics projects, a leader of networking technologies requested to test dispensing performance of a thermally conductive material, Fujipoly Sarcon SPG-50A. This material improves heat dissipation for higher frequency applications and reduces the negative effects of thermal resistance under heat, cold, humid, and thermal shock conditions. The customer's goal was to dispense a 1mm diameter dot with acceptable speed and consistency.

GPD Global

SMT Mounter for The Automotive Electronics Industry Solutions--KINGSUN

Technical Library | 2023-09-21 09:46:03.0

SMT machines have become indispensable production equipment in the automotive electronics industry.They can more effectively produce high-quality and complex electronic components and quickly respond to market demand...... KINGSUN professional provides various brands new and refurbished SMT equipment , as well as global one-stop solution services.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

SMT Printing Collapse Causes and Countermeasures --KINGSUN

Technical Library | 2023-12-15 03:06:24.0

The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

SMT Offline X-Ray Machine - Enhancing Component Reliability

Technical Library | 2023-09-15 11:16:39.0

Elevate your electronics manufacturing with the SMT Offline X-Ray Machine. Achieve comprehensive component inspection and reliability assurance through advanced X-ray technology.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

SMT Stencil Design And Consideration Base on IPC

Technical Library | 2010-03-23 11:50:22.0

This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology

Association Connecting Electronics Industries (IPC)

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2020-02-26 23:24:02.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

ASYMTEK Products | Nordson Electronics Solutions

Dispensing EMI Shielding Materials: An Alternative to Sputtering

Technical Library | 2021-06-15 15:17:33.0

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.

ASYMTEK Products | Nordson Electronics Solutions

Unlock Precision Soldering: Automatic Visual Soldering Robot

Technical Library | 2023-09-13 11:56:22.0

Discover the ultimate soldering solution with our Automatic Visual Soldering Robot. Achieve flawless, precise soldering for your electronic components. Boost productivity and reduce errors with cutting-edge technology.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

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technology electronics searches for Companies, Equipment, Machines, Suppliers & Information

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD is a company which mainly provide used and new SMT parts, provide repair SMT key parts service,new/used SMT machine trading,SMT consumables and Peripherals equipment,Clean room, ESD..

Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Distributor / Consultant / Service Provider

3th, Tangchang 3rd Road, Hengli, Dongguan City
Dongguan, China

Phone: 008615629932323

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Thermal Transfer Materials.