Used SMT Equipment: bga solder balls warpage effect (Page 1 of 1)

Yamaha YV100XGP

Yamaha YV100XGP

Used SMT Equipment | Pick and Place/Feeders

Yamaha YV100xg placement machine parameters High-speed, high-precision, multi-functional modular placement machine 0.18 seconds/CHIP ultra-high-speed placement (best conditions) 16200CPH (grains/hour) In the IPC9850 state, the patch speed is as high

Qinyi Electronics Co.,Ltd

Torch A8N

Torch A8N

Used SMT Equipment | Soldering - Reflow

A8N Main electric part uses international brand components. Temperature control design achieves international advanced level with stable and even temperature. It is suitable for soldering CSP, BGA component. Energy-saving inner oven design and heat

Beijing Torch Co.,Ltd

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