Industry News | 2025-02-24 12:52:40.0
Nihon Superior Co. Ltd. is pleased to announce its participation in the 2025 IPC APEX EXPO at the Anaheim Convention Center, March 18-20, 2025. Visitors to Booth #2206 will experience Nihon Superior's latest breakthroughs in soldering technology, including the SN100CV® P608 solder paste, the LF-C2 lead-free alloy, and the TempSave™ series of low-temperature soldering materials, designed to meet the evolving needs of the electronics manufacturing industry.
| 1 |
