Industry News | 2013-05-11 22:01:39.0
The MPM® EnclosedFlow™ print head by Speedline Technologies is a revolutionary enclosed media printing technology that offers significant process and cost advantages over printing with metal squeegee blades. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.
Industry News | 2001-02-06 14:27:18.0
Juki Automation Systems unveiled its innovative new screen printer for use in printed circuit board production and SMT applications at APEX 2001 in San Diego, CA. The KS-1700 features a Juki original floating and rotating squeegee head design. The squeegee head is equipped with a linear guide and cylinder, allowing it to rotate 90 degrees, and enabling the operator to easily clean front and back blades.
Industry News | 2008-03-19 14:21:17.0
Essemtec will feature SP003-MLV, a semi-automatic stencil printer with vision for faster control and alignment correction, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2005-09-23 13:31:20.0
The SP200-AVC from ESSEMTEC is a new stencil printer for fully automatic SMT assembly lines. The unique trans-stencil vision system, the integrated stencil cleaner and the continuous squeegee pressure regulation provide highest precision and reliability. The printer is designed for quick setup and changeover.
Industry News | 2001-02-12 16:28:41.0
Ultrasonic Systems introduces the EZ-Flux automatic spray fluxing system for economical application of flux to printed circuit boards. EZ-Flux utilizes spray nozzle technology with two-direction spray. An air-actuated traversing mechanism provides precise motion control at a speed of 10-15 inches per second.
Industry News | 2013-09-24 14:26:38.0
Engineered Material Systems debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.
Industry News | 2013-05-30 22:20:56.0
Speedline Technologies will be exhibiting newly-introduced equipment and participating in the technical conference at SMTA International this coming October.
Industry News | 2013-09-10 13:37:32.0
Speedline Technologies will be exhibiting newly-introduced equipment and participating in the technical conference at SMTA International 2013 at the Fort Worth Convention Center, Fort Worth, Texas.
Industry News | 2003-03-11 09:04:04.0
Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.
Industry News | 2011-04-20 21:38:55.0
Both local and international electronics manufacturers are aware of the fact that to miss a NEPCON China event is to forego numerous exciting business opportunities. NEPCON China is a trusted barometer of the state of the electronics manufacturing industry in China and Asia.
