Industry News | 2019-04-30 18:05:43.0
Nordson ASYMTEK will exhibit its new conformal coating line and dispensing solutions at SMTconnect, Nuremberg, Germany, with SmartTec GmbH in Stand 4-101 and in the Fraunhofer IZM Future Packaging Line Stand 5-434. In addition, Gerd Schulze, key account manager, Nordson ASYMTEK, will present "Protecting Electronics -- Adhesive and potting options and practical examples" at SMTconnect Technology Days. SMTconnect is being held May 7-9, 2019.
Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Industry News | 2011-11-20 11:17:54.0
Count On Tools announces improvements to its revolutionary StripFeeder Trays for loading tape-and-reel components onto compact modules for prototyping and high-mix low-volume applications.
Industry News | 2012-10-18 19:02:31.0
IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2017-08-08 13:41:02.0
SMTA announces that Bill Bader, CEO of iNEMI, will keynote the 2017 Technical Innovations Symposium on Monday, September 18, 2017. The symposium is part of the SMTA International technical conference September 17 - 21, 2017 in Rosemont, Illinois. Bader’s presentation is titled “2017 iNEMI Roadmap Highlights Impacting Board Assembly over the Next 5-10 Years.”
Industry News | 2013-04-15 15:41:10.0
Nordson ASYMTEK will demonstrate its SelectCoat® SL-940E conformal coating system with dual applicators as well as a surface mount adhesive dispensing platform at SMT Hybrid Packaging, Nuremberg, smartTec GmbH stand #7-219.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2018-10-18 08:53:06.0
Mixed process of SMT reflow oven
Industry News | 2011-04-20 15:59:29.0
Count On Toos Inc. introduces new MYDATA Glue Tools for applying adhesive to boards by pin transfer. The new product line includes all standard glue tools (C12, B12, B13, C13 andB14) as well as custom designed tools based on customer specific requirements.
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
