Industry News: asm die bonders (Page 1 of 6)

Baja Bid Online Auction – June 3-5, 2014 (Featuring Items From OneChip Photonics)

Industry News | 2014-05-22 15:42:29.0

Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.

Baja Bid

OneChip Photonics Facility In Canada Closing – All Assets Being Sold

Industry News | 2014-06-03 13:04:15.0

The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.

Baja Bid

International Wafer-Level Packaging Conference (IWLPC) Workshops

Industry News | 2016-08-23 16:25:55.0

The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

Palomar Technologies’ 3800 Ultra Flexible Die Bonder Wins Distinguished Industry Award

Industry News | 2010-10-27 20:21:50.0

Palomar Technologies, a leading supplier of solutions for microelectronic and optoelectronic packaging, announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its 3800 Ultra Flexible Die Bonder.

Palomar Technologies

Tresky to Display T-6000 Die Bonder at SEMICON West 2013

Industry News | 2013-06-20 19:12:14.0

Tresky, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.

Tresky AG

Finetech Shows Support for University Research

Industry News | 2012-02-07 16:16:09.0

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.

Finetech

Pennsylvania State University Wins Finetech Die Bonder Donation

Industry News | 2012-08-29 10:27:05.0

Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.

Finetech

Donated Finetech Die Bonder Installed at Pennsylvania State University

Industry News | 2013-03-11 09:10:32.0

A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.

Finetech

Microtek Adds FINEPLACER® Lambda Die Bonder to New Facility

Industry News | 2016-07-25 15:46:30.0

Finetech, a global supplier of micro-assembly equipment, and Microtek, a microelectronics product development innovator, announce the addition of a FINEPLACER® Lambda bonding system at the recently opened Microtek facility. The die bonder will be used for customized packaging applications in prototype and development projects, including wireless, photonics and medical diagnostics and therapeutics.

Microtek, Inc.

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Industry News | 2013-01-04 08:55:03.0

Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder

Finetech

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