Industry News | 2001-11-27 13:09:48.0
IPC has announced its tutorial and workshop schedule for IPC Printed Circuits Expo 2002. A total of 34 courses are scheduled, including 15 full-day tutorials on March 24-25, and 19 half-day workshops, which will take place on March 25 and 28.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2022-01-10 16:58:23.0
The news is full of constantly new, improved products and services that require microelectronics. STI Electronics, Inc. has the ability to be your sole partner, from concept to finished product. STI's Microelectronics Packaging Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today's electronics assemblies.
Industry News | 2016-09-23 15:16:53.0
NEO Tech announced that its highly miniaturized electronic manufacturing capabilities are being deployed in advanced implantable devices and electroceuticals for the medial industry.
Industry News | 2011-07-18 13:17:11.0
STI Electronics will feature its key engineering services at the upcoming Space and Missile Defense Conference and Exhibition, scheduled to take place August 15-18, 2011 at the Von Braun Center in Huntsville, AL.
Industry News | 2011-10-28 21:08:43.0
STI Electronics will feature its key engineering services in Booth #122 at the upcoming Defense Manufacturing Conference (DMC)
Industry News | 2012-11-13 15:57:38.0
STI Electronics, Inc. will exhibit in Booth #601 at the upcoming Defense Manufacturing Conference (DMC), scheduled to take place November 26-29, 2012 at the Marriott Orlando World Center in Orlando, FL.
Industry News | 2015-03-23 12:27:07.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.
Industry News | 2010-10-14 17:28:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key engineering services at the upcoming Lockheed Martin LM Connect Conference.
Industry News | 2010-10-29 23:55:24.0
STI Electronics, Inc. will highlight its key engineering services in Booth 119 at the upcoming Defense Manufacturing Conference, scheduled to take place November 29-December 2, 2010 at The Venetian in Las Vegas, NV.
