Industry News: cu thickness-- (Page 1 of 2)

SMTA Announces Pan Pacific Symposium Call for Papers

Industry News | 2010-05-30 23:23:13.0

Minneapolis, MN - The Surface Mount Technology Association (SMTA) announces the Call for Papers for the 2011 Pan Pacific Microelectronics Symposium, which will be held January 18-20, 2011 on the Big Island of Hawaii. The symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The deadline for abstracts is July 16, 2010.

Surface Mount Technology Association (SMTA)

Pan Pacific 2011 Call for Abstracts

Industry News | 2010-08-17 13:31:00.0

The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe!

Surface Mount Technology Association (SMTA)

SMT reflow oven process principle and introduction

Industry News | 2018-10-18 09:42:39.0

SMT reflow oven process principle and introduction

Flason Electronic Co.,limited

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Resin plug application and process

Industry News | 2019-05-16 01:24:13.0

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.

Headpcb

Heraeus Electronics Announces Global Launch of Condura®.ultra Ag Si3N4 free AMB Substrate at PCIM Europe

Industry News | 2022-05-18 12:32:37.0

Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.

Heraeus

Nihon Superior to Present at SMTA International 2011

Industry News | 2011-10-16 00:20:48.0

Nihon Superior announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011.

Nihon Superior Co., Ltd.

Practical Components to Display Its Latest Products at the IPC APEX EXPO

Industry News | 2013-02-04 14:14:48.0

Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo

Practical Components, Inc.

Practical Components and PACTECH Offer Flip Chip Test & Evaluation Kit and Board

Industry News | 2010-09-22 14:26:54.0

Practical Components Inc., a leading international national distributor of dummy SMD and thru-hole components, test boards, training/setup kits and supplies, announces a new PACTECH PCB310 Flip Chip Test & Evaluation Board for placement and daisy chain continuity testing after assembly.

Practical Components, Inc.

Practical Components Announces PCB200-Thermal Cycle Availability

Industry News | 2010-07-16 16:08:56.0

Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces in-stock availability of the popular 15 mm PoP Thermal Cycling Board.

Practical Components, Inc.

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