Industry News | 2010-07-08 12:04:50.0
New method creates super-thin, high integrity, continuous metal lines that surpass today’s semiconductor industry requirements.
Industry News | 2015-08-20 07:54:00.0
Seika Machinery,announces that Michelle Ogihara, Senior Sales Manager at Seika and SMTA Director & VP of Communications, will host the Surface Mount Technology Association (SMTA) Women’s Leadership Connection Reception at SMTA International. The reception is scheduled to take place Monday, Sept. 28, 2015 from 5-6:30 p.m. in Room 42/43 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2016-09-01 19:08:12.0
Seika Machinery announces that Michelle Ogihara, Senior Sales Manager at Seika and SMTA Director & VP of Communications, will help to host the Surface Mount Technology Association (SMTA) Women’s Leadership Program at SMTA International. The event is scheduled to take place Monday, September 26, 2016 at 2 p.m. in Room 48 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2016-09-06 16:10:15.0
KYZEN today announced that it is a sponsor for the Surface Mount Technology Association (SMTA) Women’s Leadership Program during SMTA International for the fourth year since the event’s inception. The event is scheduled to take place Monday, Sept. 26, 2016 at 2 p.m. in Room 48 at the Donald Stephens Convention Center in Rosemont, IL. All women attending SMTA International are invited to attend the annual SMTA Women’s Leadership Connection Reception where women can come together to network and socialize.
Industry News | 2018-05-31 10:23:37.0
Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
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