Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2010-12-03 21:35:04.0
Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
Industry News | 2018-10-18 08:40:47.0
Stencil aperture considerations for QFN chips
Industry News | 2012-03-28 21:08:39.0
Manncorp's new "Production Runner" turnkey PCB production line is designed to meet the needs of high-mix, low-to-mid-volume automated assembly and is equally suitable for both short and long runs. The line includes Manncorp’s acclaimed dual-head 8,000 cph MC-385V2V pick and place, the 5500 dual squeegee stencil printer and the CR-4000C lead-free hot air convection reflow system.
Industry News | 2013-07-15 14:58:08.0
Mobility is the driving force in electronics.
Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2018-10-02 12:29:44.0
ADLINK announces the addition of the quad-core Intel® Core™ i3-8100H processor to its recently released Express-CF COM Express Basic size Type 6 module based on the 8th Generation Intel® Core™ i5/i7 and Xeon® processors (formerly Coffee Lake).
