Industry News: reflow 2850 281 (Page 1 of 1)

Nihon Superior to Highlight TempSave Soldering Materials at SMTAI

Industry News | 2024-09-23 20:42:25.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #2850 at the SMTA International Exposition, scheduled to take place October 22-24, 2024 at the Donald E. Stephen Convention Center in Rosemont, IL. The company also will showcase LF-C2 P608 solder paste.

Nihon Superior Co., Ltd.

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