Industry News | 2003-02-12 09:25:17.0
35% stake in Topgrow Technologies
Industry News | 2013-08-14 11:48:01.0
IPC – Association Connecting Electronics Industries® will host one-day conference, “Conflict Minerals: Complying with EU and US Laws” on October 23, 2013, in Brussels to help European and U.S. companies plan for compliance with current and future customer and legal requirements.
Industry News | 2010-04-10 02:22:08.0
Helping electronics manufacturing companies better manage the growing documentation required to ensure products comply with evolving environmental regulations, IPC — Association Connecting Electronics Industries® has released IPC-1752A, Materials Declaration Management. The A revision of the standard provides an updated and expanded industry-wide reporting format for material declaration data exchange between companies in the electronic interconnect supply chain.
Industry News | 2003-04-23 10:16:43.0
The funds will be used to repay the $97 million term loan outstanding under the existing credit facility and for general corporate purposes.
Industry News | 2003-05-08 07:52:36.0
IEC reported net income of $726,000 or $0.09 per share on revenue of $15.5 million for the second quarter.
Industry News | 2002-04-11 08:13:43.0
Sheldahl�s Sales Slipped 21% in 2001, According to the Company�s Filing With the U.S. Securities Exchange Commission
Industry News | 2011-09-23 21:12:22.0
R&D Technical Services. announces that David Suihkonen, President, will chair a technical session at the upcoming SMTA International Conference & Exhibition
Industry News | 2012-12-07 14:15:58.0
H&T Global Circuits,announces the completion of its first international trade fair.
Industry News | 2016-09-02 03:22:09.0
We present the market leading Condor Sigma W12, equipped with a rotating 13500W 518x513mm heater stage that can uniformly warm up your sample to temperatures up to 175°C. The system is designed for die shear testing on large rectangular glass carriers and 12 inch round carriers, to test glued or solder interconnections on a coating.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
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