Industry News | 2011-02-14 16:47:35.0
FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.
Industry News | 2011-09-12 13:16:36.0
FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition
Industry News | 2012-09-05 08:13:47.0
Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition
Industry News | 2014-06-10 11:59:03.0
(Albany, NY) June 10, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new encapsulant products that enable greater production temperature flexibility for microchips with different alloy applications.
Industry News | 2015-08-27 09:41:13.0
Seika Machinery will exhibit in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Seika team will be available to demonstrate the following equipment: DEN-ON INSTRUMENTS CO., LTD. RD-500V Rework Station, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM SPS Solder Paste Mixer and MALCOM Spiral Viscometer.
Industry News | 2015-08-27 13:31:06.0
Seika Machinery will exhibit in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Seika team will be available to demonstrate the following equipment: DEN-ON INSTRUMENTS CO., LTD. RD-500V Rework Station, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM SPS Solder Paste Mixer and MALCOM Spiral Viscometer.
Industry News | 2009-12-07 20:48:59.0
At Productronica 2009 in Munich, Finetech is starting into a new era of its history and is pleased to report good attendance and keen interest in the displayed products.
Industry News | 2007-11-27 12:13:09.0
FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2009-04-10 00:26:25.0
OK International is preparing to take a wide range of innovative soldering and production assembly technologies to this year's Nepcon Shanghai being held over 21st � 24th April. On display at Booth 1D06, each system is designed to reduce training investment, perform a diverse array of applications and measurably increase productivity.
