Industry News: rf test equipment procedures (Page 1 of 23)

New Reference Guide from Schaffner Provides Comprehensive RF Immunity Test Information for Engineers

Industry News | 2003-03-10 08:41:03.0

provides an overview of the main features of both conduction coupling and radiated field coupling, the two primary RF immunity test methods.

SMTnet

EMC Automotive Component Testing Detailed in Free Wall Chart from Schaffner EMC

Industry News | 2003-06-25 12:28:40.0

The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.

SMTnet

Kit Checks Out Pick-and-Place Equipment

Industry News | 2003-06-18 07:56:46.0

The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.

SMTnet

REMEC Deploys AWR Design Flow Worldwide

Industry News | 2003-06-09 09:16:38.0

The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.

SMTnet

Most Versatile Actuator to Date

Industry News | 2003-04-17 08:15:33.0

In launching the LA35 series, SMAC reckons it has produced an actuator with unrivalled versatility.

SMTnet

Teradyne Introduces Optima 7210 Optical Process Test 'OPT' System

Industry News | 2003-04-02 09:03:49.0

Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation

SMTnet

Upgraded CAM Software Eliminates More Bugs

Industry News | 2003-03-12 08:28:44.0

CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.

SMTnet

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

SMTnet

Test Protocols for Evaluation of New Lead-Free Alloys Outlined in New White Paper by IPC Solder Products Value Council

Industry News | 2010-06-04 16:23:16.0

BANNOCKBURN, Ill., USA — The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.

Association Connecting Electronics Industries (IPC)

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