Industry News: slump (Page 1 of 8)

Lead-free Reflow Profile: Soaking type vs. Slumping type

Industry News | 2018-10-18 08:44:36.0

Lead-free Reflow Profile: Soaking type vs. Slumping type

Flason Electronic Co.,limited

North American PCB Book-to-Bill Ratio Increases to 1.04

Industry News | 2016-03-02 13:33:49.0

IPC announced today the January 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders slumped in January, but orders continued to outpace sales, bringing the book-to-bill ratio up to 1.04.

Association Connecting Electronics Industries (IPC)

IPC Releases PCB Industry Results For May 2013

Industry News | 2013-06-28 18:52:56.0

IPC announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The PCB book-to-bill ratio stayed strong for the sixth consecutive month, remaining at 1.10, an indication that recovery from nearly a two-year slump may be starting.

Association Connecting Electronics Industries (IPC)

North American PCB Business Reflects Normal Seasonal Slowdown.

Industry News | 2014-09-02 12:43:04.0

IPC Releases PCB Industry Results for July 2014. Sales and orders were weaker in July, but the book-to-bill ratio held steady at parity.

Association Connecting Electronics Industries (IPC)

North American PCB Orders Strengthened in September IPC Releases PCB Industry Results for September 2014

Industry News | 2014-10-29 16:10:58.0

IPC — Association Connecting Electronics Industries® announced today the September findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

North American PCB Sales Growth Turns Positive

Industry News | 2017-12-04 15:11:43.0

IPC announced today the October 2017 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Positive year-over-year shipment and order growth continued October. The book-to-bill ratio remained high in October at 1.12.

Association Connecting Electronics Industries (IPC)

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

North American PCB Sales Rebound - IPC Releases PCB Industry Results for February 2016

Industry News | 2016-04-01 14:34:54.0

IPC announced today the February 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales rebounded in February, outpacing orders and reducing the book-to-bill ratio to 1.02.

Association Connecting Electronics Industries (IPC)

North American PCB Industry Returns to Positive Growth

Industry News | 2019-09-28 15:00:54.0

IPC — Association Connecting Electronics Industries® announced today the August 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales and order growth rebounded in August and the book-to-bill ratio strengthened to 1.02.

Association Connecting Electronics Industries (IPC)

An Analysis of SMT Solder Paste Printing Defects

Industry News | 2018-10-18 08:27:03.0

An Analysis of SMT Solder Paste Printing Defects

Flason Electronic Co.,limited

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