Industry News: solder joint partially reflowed (Page 7 of 48)

Wave soldering process defectives and handling solution

Industry News | 2018-10-18 07:56:58.0

Wave soldering process defectives and handling solution

Flason Electronic Co.,limited

What are the advantages of use nitrogen process for SMT reflow oven?

Industry News | 2018-10-18 08:02:28.0

What are the advantages of use nitrogen process for SMT reflow oven?

Flason Electronic Co.,limited

Solder Joint Encapsulant

Industry News | 2015-05-13 14:00:03.0

The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.

YINCAE Advanced Materials, LLC.

SHENMAO Introduces 606-P133 Solder Paste for Laser Soldering

Industry News | 2015-12-14 22:14:22.0

SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature-sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.

Shenmao Technology Inc.

SHENMAO Introduces 606-P133 Solder Paste for Laser Soldering

Industry News | 2015-12-16 18:10:21.0

SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature–sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.

Shenmao Technology Inc.

Viscom’s S3088 SPI Will Be Part of the NPL Solder Paste and Solder Joint Automatic Inspection Experience at SMTAI

Industry News | 2015-09-23 16:47:32.0

Viscom announced today that its S3088 SPI system will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.

Viscom AG

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited

Analysis of how to spot welding process

Industry News | 2018-10-18 09:46:58.0

Analysis of how to spot welding process

Flason Electronic Co.,limited

Surface-mount technology

Industry News | 2018-10-18 09:15:23.0

Surface-mount technology

Flason Electronic Co.,limited

New Technology for Void-free Reflow Soldering

Industry News | 2018-10-18 09:16:42.0

New Technology for Void-free Reflow Soldering

Flason Electronic Co.,limited


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