Industry News | 2011-09-01 20:33:47.0
Bragging rights are on the line as the First Annual IPC Midwest Soldering Competition takes place, September 21-22, in Schaumburg, Ill., to determine the Best Hand-Soldering Technician in the Midwest for 2011.
Industry News | 2015-03-16 17:08:55.0
Universal Instruments and Schweitzer Engineering Laboratories have enjoyed a successful partnership for many years, with Universal being the first capital equipment supplier to be awarded preferred-supplier status with SEL. Universal was also recognized as one of the company’s Supplier Success Stories of 2010.
Industry News | 2011-06-14 14:37:55.0
The white light axial chromatism technique utilized by Nanovea’s 3D Non Contact Profilometers has become widely known as a vital bench top research and verification tool. It is now the Automated Optical Inspection (AOI) environments that have begun to acknowledge Nanovea’s superior capability. Unlike the traditional vision and laser systems that typically sacrifice one feature for another, speed or resolution, Nanovea provides both. Vision and laser systems also have very limited automated surface measurement options, where as Nanovea’s system provides a wide range including: Profile, Dimension, Roughness, Shape & Form, Flatness & Planarity, Volume Area, Step-Height Depth and Thickness. And keep in mind, the technique utilized by Nanovea’s inspection system has the superior ability to measure nearly any material surface and zero influence from sample reflectivity or absorption.
Industry News | 2011-02-24 21:33:45.0
JEDEC Solid State Technology Association today announced the publication of its next-generation storage system standard, Universal Flash Storage (UFS). UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers.
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