SMTnet Express, December 3, 2015, Subscribers: 23,818, Members: Companies: 14,782, Users: 39,472 HCFC-225 Phaseout - What Now? Ed Kanegsberg; BFK Solutions LLC On January 1, 2015, nine months from APEX 2014, the production and use restrictions
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP Myung-June Lee
SMTnet Express, December 12, 2019, Subscribers: 33,007, Companies: 10,941, Users: 25,408 IPC APEX EXPO 2020 – Celebrating 20 Years of Excellence in Electronics This year marks the 20th anniversary of IPC APEX EXPO and IPC is thrilled
SMTnet Express, November 19, 2014, Subscribers: 23530, Members: Companies: 14112, Users: 37185 Effects of Packaging Materials on the Lifetime of LED Modules Under High Temperature Test Lei Nie, Wenjing Xiang - Hubei University of Technology
SMTnet Express, November 28, 2014, Subscribers: 23553, Members: Companies: 14124, Users: 37254 Preparation, Manufacturing Lead-Free Soldering Alloy Tarik Talib Issa, Asmaa Shawky Khalil - University of Baghdad . A soldering alloy
SMTnet Express, February 5, 2015, Subscribers: 22,336, Members: Companies: 14,212 , Users: 37,659 An Alternative Solvent with Low Global Warming Potential R. Basu and R. Hulse - Honeywell International In the past 20 yrs the solvent industry has
SMTnet Express, February 12, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing Sabuj Mallik
