734 gold edge contact results

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale

Horizontal Convection Reflow Technology Defined

Developing an effective, fast-curing, environmentally sound conformal coating

SMT Express, Issue No. 5 - from SMTnet.com

SMT Express

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

Cleanliness of Stencils and Cleaned Misprinted Circuit Boards

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

SMTnet Express - July 24, 2014

aluminum or gold wire. Gold wire provides the abilit