Express Newsletter: panasonic head maintenance (Page 1 of 53)

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

AllSurplus announces Panasonic NPM-W P&P Auction ☀ November 11–23 - 2021 SMTnet Express, November 11

AllSurplus announces Panasonic NPM-W P&P Auction ☀ November 11–23, 2021 SMTnet Express, November 11, 2021, Subscribers: 26,497, Companies: 11,460, Users: 26,919 Understanding the Cleaning Process for Automatic Stencil Printers

Lead-Free Wave Soldering

upon copper dissolution and solder maintenance issues

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