738 universal instruments j11 controllers results

SMTnet Express - October 27, 2016

SMTnet Express, October 27, 2016, Subscribers: 26,530, Companies: 15,009, Users: 41,321 Press Fit Technology Roadmap and Control Parameters for a High Performance Process Jose Becerra, Dennis Willie and Murad Kurwa; Flex (Flextronics International

Lead-Free Rework Process For Chip Scale Packages

Lead-Free Rework Process For Chip Scale Packages News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Lead-Free Rework Process For Chip Scale Packages Universal Instruments

Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

and Low IO Flip Chip Assemblies Universal Instruments C

Fragility of Pb-free Solder Joints

Fragility of Pb-free Solder Joints News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Fragility of Pb-free Solder Joints Universal Instruments Credit/Source: Peter Borgesen

Assembly Process Variables Voiding At A Thermal Interface

Interface Universal Instruments Corporation Muffada

SMTnet Express - December 16, 2017

SMTnet Express, December 16, 2017, Subscribers: 31,015, Companies: 10,789, Users: 24,054 Controlling Voiding Mechanisms in the Reflow Soldering Process Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita; Nihon Superior Co., Ltd

SMTnet Express - March 29, 2018

SMTnet Express - March 29, 2018

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Defect Coverage for Non-Intrusive Board Tests

Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies