SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
SMTnet Express, December 27, 2013, Subscribers: 26441, Members: Companies: 13537, Users: 35564 Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly by Mario Scalzo; Indium Corporation While the electronics manufacturing
SMTnet Express, April 23, 2020, Subscribers: 36,173, Companies: 10,991, Users: 25,763 Flexible Bioelectronics For Physiological Signals Sensing And Disease Treatment Credits: University of Electronic Science and Technology of China This review
SMTnet Express, May 26, 2016, Subscribers: 24,776, Companies: 14,803, Users: 40,361 Influence of Salt Residues on BGA Head on Pillow (Hip) J. Servin, P. Gomez, M. Dominguez, A. Aragon; Continental Corporation The oxide layers are known as wetting
and Low IO Flip Chip Assemblies Universal Instruments C
WINTECH provides new/used/pre-owned SMT, AI & PCB Assembly (PCBA) equipment of various brands. Also supply service, modification & original or local-made spare parts. We are also an appointed agent for well-known brands.
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