General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Time Pressure Liquid Dispensing Pump with Foot switch / Dry contact A great addition to Fully Automatic Dispensing System Time pressure is a versatile method of dispensing that functions across a wide range of viscosities. This dispensing method wo
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
E-mail: Lyric.lin@qy-smt.com Facebook: Lyric Lin Whatsapp: +86 15626851571 Wechat: 15626851571 ML-100 Manual PCB Separator（Hand Push Type） The ML-100 is suitable for a small number of PCB boards to be separated and does not require
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
ML-100 Manual PCB Separator（Hand Push Type） The ML-100 is suitable for a small number of PCB boards to be separated and does not require electricity or air pressure. The PCB is manually fed between the blades to separate, which is very simple and f
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
