Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Precise coating discrete dots with the DispenseJet DJ-9500. http://www.nordsonasymtek.com
Good Price Reflow Oven Soldering Machine ❙ Introduce of Reflow Soldering Oven High quality SMT reflow ovens, PCB soldering oven machine, lead-free reflow oven, for PCB soldering. ETA SMT machines manufacturers offers from 6-12 zones good pr
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
The first technology to use centrifugal energy to clean electronic circuit assemblies, precision parts, and semiconductor packages. The system offers unparalleled penetration, solubilization, and contaminant removal The MicroCel Centrifugal Cleanin
SMT PCBA X-ray Machine ETA-7900 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt x ray,smt x ray machine,x-ray inspection machine,x-ray d
Flip Chip Thermosonic Bonding with the FINEPLACER® pico MA. http://eu.finetech.de/micro-assembly/products/fineplacerr-pico-ma.html More information about Thermosonic bonding: http://eu.finetech.de/micro-assembly/technologies/ultrasonic-thermosonic-b
ScanCOMPONENT is a PC-based offline component programming system for the creation of vision data files from the smallest flip chip and bumped packages to the largest odd form devices. The ScanCOMPONENT is a standalone Product as well as a module of
The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are proces
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