Electronics Forum: ball grid array (Page 1 of 20)

BGA ball size reliability

Electronics Forum | Fri May 07 16:28:07 EDT 1999 | Andrew Wulff

On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This is a known L

Dye Penetration test for area array package failure analysis

Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef

First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis

solder ball attachment machines

Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco

Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching

Solder ball specifications?

Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef

Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla

Re: BGA ball size reliability

Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon

On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? This

Re: BGA ball size reliability

Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff

On 1.27mm (0.050 inches) Standard Ball Grid Array's. The ball size diameter starts at approximately 0.025 inches. If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable?

Re: BGA ball missing.

Electronics Forum | Sun Aug 30 16:36:31 EDT 1998 | Steve Gregory

Hi Kc! I went to Surface Mount International last week, and had a chance to see a way to reball BGA's that is very simple, and not expensive at all. I've seen the advertisements in a few magazines, but this was the first time I've seen it live. It's

PBGA and CBGA

Electronics Forum | Thu Aug 17 23:44:26 EDT 2006 | guest

CBGA stands for Ceramic Ball grid array while PBGA stands for Ceramic Ball grid array. Noticable difference is the substrate used , one is using ceramic and one is using BT laminate. Regards

BGA ball vs land design problem??

Electronics Forum | Thu Jun 04 20:06:30 EDT 2009 | davef

Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD w

Ball Grid Array Prototyping

Electronics Forum | Wed Jan 26 00:53:40 EST 2005 | Adam

Are there any methods for mounting ball grid arrays without a reflow oven? More and more chips are coming in the format and as a student I am not interested in production line quantities.

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