Electronics Forum: thermal cycle (Page 1 of 33)

Prifiling Board life cycle

Electronics Forum | Fri Jan 04 14:21:35 EST 2008 | ck_the_flip

If all your doing is trying to measure oven repeatability, but then you wanna do it a bunch of times, have a profiling "board" constructed out of say... delmat, delrin, or some other glastic-type pallet material. Have the T/C's permanently fastene

Prifiling Board life cycle

Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz

Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber

Number of thermal excursions per componet

Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef

BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar

Re: Rework induced thermal shock of SMD capacitors

Electronics Forum | Wed Dec 31 08:55:09 EST 1997 | justin medernach

Has anyone had any experience with thermal shocking and cracking of SMD capacitors during the rework process? My company was advised to preheat capacitors to 125 C at a rate of 2 C/sec before replacing them onto boards. Would this maybe

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella

When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca

Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Sun Dec 10 20:17:51 EST 2017 | myke03o

Hi Dave, thanks for the response. * Improve your products that are used for thermal cycling testing of products of other companies? Yes we want to improve our products to pass thermal cycling and prolong the lifespan of the baord. * Change your pr

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Nov 23 20:01:05 EST 2017 | myke03o

Hi to all experts, Can anyone advice us what solder alloy to use for thermal cycling products. We are facing a lot of issues using normal solder paste SAC305. After thermal cycling the solder is cracking. Any suggestion is welcome. Thanks in advanc

How to get away jointing problem

Electronics Forum | Mon Apr 04 08:01:49 EDT 2005 | davef

Can you run one thermal cycle to attach the BGA and then a different thermal cycle to attach the connector?

Tin Whisker Testing

Electronics Forum | Tue Oct 11 14:10:51 EDT 2005 | Amol

Hi, I have a very basic question for tin whisker testing. Do I thermal cycle/age the Components only or solder them to a ckt board and then thermal cycle/age the PCB assembly??

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