Electronics Forum | Thu Jul 10 13:33:22 EDT 2003 | Louis
I am assuming that there may not be any other > parts on this board? > > Russ
Electronics Forum | Thu Jul 10 15:55:14 EDT 2003 | russ
Great point Stephen!! I failed to mention that little detail. Russ
Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen
The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating
Electronics Forum | Wed Aug 27 21:03:03 EDT 2003 | davef
What does TDK [ http://www.component.tdk.com/fa/factoryautomation.html ] say?
Electronics Forum | Tue Sep 09 20:23:23 EDT 2003 | Pfb
We are using gold plated leads on SMT devices. Gold embrittlement is supposed to be a problem at concentrations above 4%. Has anyone done any work to qualify this?
Electronics Forum | Wed Sep 17 15:44:28 EDT 2003 | davef
Look here: http://nepp.nasa.gov/DocUploads/CE5125B5-E0EB-4CFA-8867BE3F3E342CA5/moisture%20effect%20Ta%202C%20M.pdf
Electronics Forum | Fri Sep 19 13:55:05 EDT 2003 | joeherz
Russ, I feel a little better now.... Baking specs...... Can you give me a tip on where to look? It's a 4 layer, .062 and roughly 5 inches square. Thanks.
Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
Electronics Forum | Mon Oct 13 13:49:29 EDT 2003 | mrmaint
Does anyone know of a standard stencil thickness for BGA'S. We currently use 4 to 5 mil stencils depending on component mix. Is an aperature reduction required for BGA'S. If so what percentage. Any help would be greatly appreciated. Thanks MRMAINT
Electronics Forum | Thu Oct 16 13:18:13 EDT 2003 | jseagle
3 digits usually means 5% i.e. 103 = 10K 5% 4 digits means 1% i.e. 1002 = 10K 1% Otherwise you will have to use Dave's method.
