Electronics Forum: (4) (Page 176 of 630)

BGA Rework

Electronics Forum | Mon Apr 28 04:02:39 EDT 2003 | chrissieneale

Hey, i'm back from the holiday. Progress on this board is quite good actually, althought the guy who i got to take off and replace all the bga's won't even look me in the eye!! He said he had a really tough job re-doing all the paste. 22 BGA's in a

Update (No Tech Content)

Electronics Forum | Thu Apr 24 07:39:16 EDT 2003 | caldon

Stefan- This is the hardest time I have had finding a job. 85% of my response has been through my network of contacts. My current position I had been working on for 4 months. Advise- Utilize all of your contacts be it industry, church, neighbors, or

Please help a newbie

Electronics Forum | Wed Jun 18 19:16:56 EDT 2003 | GEJames

hello all - i am i need of a simple electronic counting device but i know little about electronics. would someone please describe to me the parts I'd need and the assembly process to create a computer that meets the following specs: 2 digital LED t

Gold Leaded SMT devices

Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef

The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu

Who has experience in IPC-TM-650 2.6.3.1 Environment test Method

Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee

Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a

Anyone who has experience on IPC-TM650 environment test 2.6.3.1

Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry

Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a

No-Lead solder defect - No solder on pads

Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel

Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o

Freshman in SMT industry needing advice

Electronics Forum | Thu Mar 04 14:20:41 EST 2004 | Robert

Another question... I use 500gm jars of Kester 256. After a job is complete the used solder is collected and put back into the jar. Generally while a job is run, the jar and used paste could be left out/open for up to 4 hours. A piece of seran wrap i

Type 4 solder paste

Electronics Forum | Wed Apr 14 05:44:36 EDT 2004 | hun

Hi All, Just have a share with you guy. We are using T4 solder paste and also E-Stencil. We ahd try out Alpha, Kester, AIM and Qualitek. The result show Alpha had a very very heavy stack flux and can't get it clean off even by chemical

qfp reflow problems

Electronics Forum | Sat Apr 17 17:08:22 EDT 2004 | finepitch

Russ has a hint by saying "too long of a soak at too high of a temp or being in reflow for too long/hot". I think the board should stay in the oven for 3-4 minutes, spending 60-90 seconds of which during reflow. in order to stay in the oven for 3 m


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