Electronics Forum: (4) (Page 196 of 630)

seeking low cost fix to tce mismatch

Electronics Forum | Mon Dec 27 22:45:58 EST 1999 | Jim

Is there a way to avoid the reliability problems arising from the tce mismatch between ceramic chip smc's and FR4 laminates, without spending an arm and a leg on expensive substrate materials? Are there inexpensive substrates with reasonably compata

Re: Stencil Aperture Reduction Guidelines

Electronics Forum | Fri Dec 17 01:21:54 EST 1999 | Victor Salazar

Weare using a Home plate design on 1210 or larger, 20% reduction on pkgs from 1206 to 1210, 10% reduction on 1206 or smaller, 0 reduction on all leaded components(sot-23, IC's) with a 6 mil stencil. For fine pitch we are using 4mil stencils. We h

Re: CP4-2 XY Table

Electronics Forum | Tue Dec 07 22:05:19 EST 1999 | sin

Added to MARK suggestion, you should verify you xy table height also by using the meter listed in the maintenace manual. If everything is fine, then i suggest you should check the placement air kisses( can suck your component back up or release to q

Re: Double sided parts stuffing

Electronics Forum | Mon Nov 22 10:15:50 EST 1999 | Boca

Will, Wolfgang and Deon are exactly right on target. You just have to watch which side is built first. I began doing double sided reflow like this in the mid '80's, it works great. I used FR4/ GT material to hold the PCB up off of the conveyor,

Re: Looking for someone who can fix the servo board of CP 4-2

Electronics Forum | Thu Oct 28 20:14:28 EDT 1999 | xujun

hi,sai: we have a same m/c that is cp-43,but we haven't encounter the problem about servo board.I think is ac- speed- adjustment servo board.if you can conform th board is bad,consulting the fuji service agent is the best way! best regards

Re: Popcorning BGA in wave-soldering

Electronics Forum | Mon Oct 18 11:48:57 EDT 1999 | Dave F

No, but answer me this? 1 What type of BGA? 2 What's the wave process, materials and temps? Are you waving the BGA or top-side flowing it? 3 If the BGA is plastic, what are you doing to prevent/remove entrapped moisture before solder processing?

0402's Tombstoning

Electronics Forum | Thu Oct 14 11:28:38 EDT 1999 | Bryan

We recently started designing boards using 0402's. The geometry was built using IPC specs but our contract manufacturer is having a yield problem. Approx. 20% of the 0402's are tombstoning. He claims the pads should be closer together; .4 mm between

Re: Solder Mask IPC Standard

Electronics Forum | Fri Oct 08 13:04:15 EDT 1999 | Dave F

Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. PCB is FR4 Solder Mask is LPI Reflow and W/S Profile = Standard thanks and rega

Best reflow temperature

Electronics Forum | Wed Sep 15 07:34:49 EDT 1999 | Edmund

Hi, Can someone pls suggest to me the best reflow temperature setting for a force air convection oven. The details is as follow. 1) Heller 1700s 2) 12 zone---6 top and 6 bot 3) Solder paste --- Qualitek 691 non clean 4) board size : 159mm X 159mm

Mounting heights

Electronics Forum | Thu Aug 26 07:35:32 EDT 1999 | Robert Meston

For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. Does anyone have any new ideas on how t

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