Electronics Forum | Wed May 17 05:13:22 EDT 2000 | Chris May
You can refer to ANSI/J-STD-001B section 6.4.3.1 which states: "When part stacking is permitted by the assembly drawing(s)/ documentation, parts SHALL not violate minimum electrical spacing between other parts or components such as terminals or othe
Electronics Forum | Thu Apr 27 04:41:48 EDT 2000 | Scott Davies
Our R&D people are looking at the possibility of "Silver Through Hole" as an alternative to "Plated Through Hole" for our future PCB specification. Do any of you have any experience of this, advantages/disadvantages, etc. I'm told that the main reaso
Electronics Forum | Wed Apr 26 22:35:10 EDT 2000 | Dave F
John, try: APC Circuits 403.250.3406 bbs291.9342 Proto Express 408.735.7137 fax1408 Proto Engineering Sunnyvale, CA 408.738.0693 Glynn Shaw Advanced Circuits 21100 E 33Road Dr Aurora CO 80011 800.289.1724 www.4pcb.com
Electronics Forum | Mon Apr 10 11:56:35 EDT 2000 | Robert Hutton-Squire
Suggestions please... I have to place a number of 1206 chip resistor arrays on the bottom side of my PCB for wave soldering. The device consists of 4 x 0603 resistors in a 1206 package. The device is available with either concave or convex terminati
Electronics Forum | Mon Mar 27 08:28:48 EST 2000 | Mark Alder
Dear Robert The reason for the bridging problem you are experiencing on your BGA's is due because of too much solder. The PCB pads need to be at least 15% larger than the sphere size of the BGA balls. If you are not using C4 (63/37) BGA spheres and
Electronics Forum | Thu Mar 23 22:20:51 EST 2000 | Dave F
Chris: I'm unsure about the kits you seek. Solderability of: * Components: J-STD-002, Dip And Look Method. Malcom Instruments makes a very nice tester. * Boards: IPC TM-650 2.4.12A Solderability, Edge Dip Method Good luck Dave F
Electronics Forum | Tue Jun 17 01:38:01 EDT 2003 | Dreamsniper
Hey fmonnette, What's wrong if I have a dry cabinet and baked all my components under 1-3%RH or say 5%RH regardless of their MS Level, whether they r level 4, 5, 5a, 6 etc.... What will be my problems in doing that process? just for curiosity, th
Electronics Forum | Fri Mar 03 06:41:09 EST 2000 | jacqueline coia
I have tried the IPC calculator and they do not have this type of component registered. When trying to select 'other' on menu, no connection can be made. The polarity if the QFP has not been decided yet (pre-PCB design) the pitch size of the componen
Electronics Forum | Wed Feb 23 09:08:55 EST 2000 | Sal
Hey Guys, Thanks for the input and suggestions. Just been onto the adhesive manufacturer who reckons they should be no issue using a reflow profile for curing his adhesive , as long as the profile duration is not 6 minutes or over, which would bake
Electronics Forum | Tue Jan 30 11:14:25 EST 2001 | svenson
I have an idea of trimming the resistors on a teflon PCB (FR4) after mounting and soldering. Can I use a laser to cut on a smt mounted resistor while the PCB is in functional test? The goal is to balance the resistances for a telecom application. Ha
