Electronics Forum: (4) (Page 236 of 630)

High complex board manufacturing

Electronics Forum | Mon Feb 16 14:18:30 EST 2009 | jorge_quijano

1000 0402's, Micro BGA, QFP 0.4mm pitch, TSOP), we are trying to know what kind of equipment do you recommend to use in our factory, we already have Screen Printer, Chip shooters, Reflow oven, AOI, Stencil cleaner (manual), X ray, ICT... what else do

Need help with Philips CSM84 or YM84

Electronics Forum | Tue Mar 31 19:26:26 EDT 2009 | Peter

Hi Tom, Thank you for many valuable hint. I will review your messaage with the machine powered up. If you can send me your mch file so I can take a look, it may help me to correct some data. my email : peterhan4u@hotmail.com , I will really appreciat

Conformal Coat peeling

Electronics Forum | Thu Apr 09 06:22:27 EDT 2009 | qualityguy

We aware of the extend time for cure, and in the CA activity we tried plasma etch and expose the sample to the current process, a screen test of 4 cycles -50C to 125C and the CC held in place. Std IPC tape test passed in current process and modifie

layer 2 groundplane disconnects after hand solder

Electronics Forum | Fri Apr 10 13:25:08 EDT 2009 | jefflkupkt

Layer 2 is the ground plane layer of a 4 layer board. After installing a 2.5 mm DC power jack and 0.1 center SIP header by hand, the ground pin disconnects and causes an open. My board supplier said they passed Electrical Test. Prepreg was within

0402 tombstones

Electronics Forum | Fri Apr 24 07:55:12 EDT 2009 | davef

TOMBSTONING OF 0402 AND 0201 COMPONENTS: "A STUDY EXAMINING THE EFFECTS OF VARIOUS PROCESS AND DESIGN PARAMETERS ON ULTRA-SMALL PASSIVE DEVICES" Michael Yuen, Heather Benedict, Kris Havlovitz, and Tim Pitsch, Plexus Electronic Assembly Corporation, N

Solder paste process

Electronics Forum | Thu Apr 30 12:59:16 EDT 2009 | realchunks

I have run design of experiments on screen printers and most times people forget about the type of board you are running; the condition of the board; manufacturer of the paste as I have seen Type 4 no-clean no-lead pastes react very differently using

Contact Systems cs3avx feeder offset

Electronics Forum | Mon May 04 14:31:19 EDT 2009 | markgray

I am trying to figure out a strange problem on our machine. When I turn on the component verifier fuction the pick in the feeder offsets to the right 3-4mils. This is causing mispicks on 0805 and 0603 parts. When I turn off the verifier the pick is c

QFN's and LGA's

Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell

Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems


Electronics Forum | Fri May 15 19:20:47 EDT 2009 | jlawson

if you have a budget for new machine, laser depanelising is pretty good for flex PCB as no physical stress on PCB like mechanical routing, thus fixturing is easier and less prone to moving the flex while cutting. Laser systens can also cut FR4 standa

GSM software upgrade

Electronics Forum | Fri May 15 01:44:50 EDT 2009 | dilogic

Since UIC does not support older machines anymore, is there another way to upgrade our GSM1? We have an I-block hardware running OS2.11 and USOS 1.4.14. I would like to upgrade to USOS 3.xx, to be able to use Enhanced Product setup feature. Any hints

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