Electronics Forum | Thu Feb 19 22:17:15 EST 1998 | Brian Morgan
| | I am currently evaluating some different reflow ovens | | for a future purchase. The manufacturers we are | | looking at are Conceptronic, BTU, and Heller. Any | | feedback on these manufacturers would be welcome. | | I am particularly interest
Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Thu Dec 06 23:34:25 EST 2001 | Beny
Pls. help. I�ve problem with non-wetting defect at capacitor termination. I have faced this problem at the 2 kinds of termination. One is chip capacitor 0603 that its outer termination surface composed with 100 Sn (Lead free) and another one is Sta
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect
We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S
Electronics Forum | Fri May 24 11:46:34 EDT 2002 | tmv
Lot's of good discussion in this string...but I think we've missed a few points. First off...turret machines are more than capable of handling the smaller component sizes (in fact, they are the best)...Machines like the SANYO TCM-3000 or Universal 47
Electronics Forum | Wed May 22 13:51:20 EDT 2002 | Phil
2 suggestions - Get a good scope - at least a 4X, but more like a 6X, 10X is best. You have a choice on used equipment for a substantial savings. A Leica Stereo 4 zoom is it. You can look for BGA scopes that have a 90` angle for looking at the balls
Electronics Forum | Thu May 23 12:20:08 EDT 2002 | cyber_wolf
Well it depends on what kind of oven you have. If you have a short oven, you are going to have a difficult time. You will probably end up having several different profiles if that is the case. We have 3 BTU TRS 212 furnaces. They are fairly long 8 zo
Electronics Forum | Fri Jun 28 01:06:49 EDT 2002 | Dreamsniper
Hi Steve, We have a Heller 1088 (4 Zone Oven) and we are using Indium NC92 with 2% silver. My Oven setting is: Zone 1 Top & Btm 125 Zone 2 Top & Btm 145 Zone 3 Top & Btm 188 Zone 4 Top & Btm 265 Belt Speed 34 cm/min I have run a profile
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
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