Electronics Forum | Mon May 21 15:39:49 EDT 2012 | davef
This paper seems to take a balanced view as an approach to assessing xray machines http://www.focalspot.com/swf/WP-Price-Performance-Value.swf Let us add to this by saying, we don't work for the company referenced above, don't own stock in the comp
Electronics Forum | Sun May 27 20:04:10 EDT 2012 | darby
I'm with SWAG. Print a 1:1 transparency of your stencil file and mark it where you want to place the pins. Place it in the product file and use it each time yor run that product. 1. Get the pcb into the print position. 2. Tape your transparency to t
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
Electronics Forum | Mon Jun 04 10:40:37 EDT 2012 | davef
I'm not aware of any such stipulation about witness [probe] marks for assembled boards, per se. Certainly, witness marks should not affect the intended performance of the assembly, you know, like damaging the solder connection or smudging solder mate
Electronics Forum | Wed Jul 04 10:17:18 EDT 2012 | daxman
Good morning, Just a few questions to clarify: 1. You backed up your machine proper data. 2. You upgraded Fuji Flexa. 3. You re-transmitted the proper data 4. Now, components are not placing properly? Do you have a fuji 96-001 calibration board? Ha
Electronics Forum | Mon Jun 25 11:33:20 EDT 2012 | davef
The immersion silver is an active surface and readily combines with sulfur from the environment. Silver sulfide tarnishes the surface and creates doubt about the integrity of the finish at inspection. [uyemura.com/library-4.htm] Your customer's boar
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
Electronics Forum | Thu Aug 16 07:40:27 EDT 2012 | bobpan
Here are a couple of things to look at. 1. Watch the machine run....and if it misses a part....make sure it doesnt blow out the next part being presented. Sometimes the air pressure is too high and the vacuum verify will blow the part out of the poc
Electronics Forum | Thu Aug 16 12:46:47 EDT 2012 | derekj
Thank you for your reply Bob. 1. It appears the machine is picking the part up, hovering over the board and rejecting it. So it's not blowing the parts out of the pocket. Turning the vv off still results in the same issue. 2. All the tolerances are
Electronics Forum | Mon Aug 20 05:45:18 EDT 2012 | bobpan
To solve your problem....you should do the following: 1. Super Lube the o-rings on the z-rod bellows. 2. Make sure your head to camera calibration and head to head calibration is good. 3. Line up the nozzle changer pocket positions. 4. Make sure you
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