Electronics Forum: (4) (Page 496 of 630)

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Tue Oct 03 20:35:23 EDT 2000 | Dave F

1. Throughput * Dispenser: Slower, may loose 70% of tact on fast chip shooters * Printer: Can be put in front of and use fast chip shooters effectively 2. Rework Rate ???? Deposition control???? * Dispenser - High control over amount paste - Coplan

Re: High temp solder

Electronics Forum | Wed Aug 30 16:00:42 EDT 2000 | Dave F

Russells: You can mix the two solders you mentioned, assuming by "96s" you meant "96Sn / 4Pb". If you heat the two tin / lead alloys to a liquid state, you�ll form a tin / lead solution with properties different from either of the two solders. The

Re: SPC?

Electronics Forum | Mon Aug 14 18:24:36 EDT 2000 | Dave F

James: Here's a starting point: 1 www.wwnet.net/~rkroy/wp-inb.html 2 www.sas.com/otherprods/jmp/Home.html 3 www.micromeg.com/ 4 Boeing SQC (avail. from Boeing for $100) is a good little package for DOS machines. 5 For Windows, SPC KISS from Air Aca

Re: Step Stencil

Electronics Forum | Sun Aug 06 16:37:00 EDT 2000 | fraser

1. A step stencil is a waste of perfectly good stainless steel! 2. They are characterised by lousy prints on the very parts that are most critical in your process - whilst leaving good prints on the easy stuff. 3. MMM.... nasty chemicals! 4. Exactly!

Re: Reflow Oven

Electronics Forum | Thu Jun 15 21:51:17 EDT 2000 | Dave F

Jeff: You're correct �7.1.3 of ANSI J-STD-001C states " Drying / Degreasing states the assembly may be treated to remove moisture and other volitiles." We don't bake "FR4" for love nor money. The archive are littered with threads along this line.

Re: Soldermask Design Rules

Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko

Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have

IP3 QFP Problems - Has anybody had the same probs?

Electronics Forum | Fri Jun 02 17:19:56 EDT 2000 | Big K

I am currently experiencing several problems with QFP's on one of our IP3's. The first problem is with QFP240 devices. We are experiencing a high reject rate with these parts when using vision type 100. What appears to happen is that the vision syste

Re: Home plate or bow tie?

Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll

I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o

Re: Screen printing glue for wave soldering SMT components.

Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper

Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy

Re: SMT assembly on Punch/return boards

Electronics Forum | Thu May 18 22:00:38 EDT 2000 | Dean

...ahh....memory lane. 10 years ago I worked on a project for a customer who needed a low cost, high volume board for RFID tags for cows (yes, moo). These boards were 0.50 inch in diameter, 50 per panel, double sided SMT punch style fabs. 300,000 b


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