Electronics Forum: (4) (Page 531 of 662)

Re: Test the solder point

Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F

Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.

Re: PCB panelization method

Electronics Forum | Tue Nov 16 09:44:18 EST 1999 | - bobar

Ken, The technology you are referring to is also known as return-to-web. This panelization method involves a hard tooled perimeter die and a press equipped with an air cushion. The PCB circuit is punched out and then inserted or "pushed" back into

Re: Polarity of parts in packages

Electronics Forum | Thu Oct 28 23:45:23 EDT 1999 | DGrenier

JC: Seen this before, many times. We fixed our problems at the co I work for by giving a packaging specification to our purchasing dept. Took some work but the payoff was pretty big. This document includes such things as orientation,pitch,tape type

Re: ESD mats

Electronics Forum | Wed Oct 27 22:58:56 EDT 1999 | Jeff Sanchez

Hany, John is right! How do I know cause I have a metal wire floor. I was faced with the same problem you are faced with now and the price was up there. I had one advantage, My floors where raised wood when we got the shop. This reduced the fati

Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William

All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join

Re: moisture in pcb's how is it measured

Electronics Forum | Tue Oct 19 22:43:31 EDT 1999 | Stu Leech

We are deeply involved with this question because we have developed a much faster way to remove moisture from PCB's. PCB's absorb varying amounts of moisture at differing rates. The rate is influenced by the laminate type board configuration , loca

Re: Tombstoning

Electronics Forum | Tue Oct 12 16:08:44 EDT 1999 | Brian

| I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).

Rephrase : mixed technology criteria.

Electronics Forum | Sat Oct 09 09:50:04 EDT 1999 | Ken Fong

Hi, We are using mixed technology in our PCBA. Would like to know whether there is any criteria governing/guiding the use of mixed technology in such aspects as: 1. Some SMDs cannot be used in some kind of PCB materials such as FR1? 2. Some SMDs are

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Mon Oct 11 08:34:52 EDT 1999 | C.K.

Thanks for the acvice, Dave and John. Like I stated above, I didn't feel comfortable with changing wave parameters since I knew that we'd be compromising our wave quality. I'll try the peelable mask thing, reprofile, and let you guys know what i fo

Re: high temperature solder alloy

Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson

| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi


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