Electronics Forum: (4) (Page 546 of 630)

BGA chip corner epoxy / adhesive?

Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef

We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi

UBLOX Tim-4A reflow problem

Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby

I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co

Streaking at Screen Printing

Electronics Forum | Fri Dec 15 07:25:21 EST 2006 | kvanzill

Hello, I am seeing something new to me and I am hoping some one some where may have resolved this before. I am running a Panasonic SPF63 screen printer with Tamura (RMA-012-FPL) solder paste. Now this problem is hard to describe but I will do my bes

maintain glue size

Electronics Forum | Tue Dec 19 20:54:52 EST 2006 | Guest

Your experience is quite different than mine. At continues dispensing,I noticed that glue dispense volume increase as the material in the syringe decrease. My machine is using air time pressure pump. This is normal for this kind of pump since ai

TNT-A capacitors placement problem at CP-6

Electronics Forum | Sat Dec 30 19:02:19 EST 2006 | mika

This type of component packages works best with vision type: 254 - irregular. Measure the total package length including the leads. Also set the body dimension x-y tolerances to at least 0.35mm and the the pick up x-y tolerences to 0.5mm in the part

TNT-A capacitors placement problem at CP-6

Electronics Forum | Sun Dec 31 10:27:39 EST 2006 | pima

Thanks Mika. I will have opportunity to check it out in New Year, because now we dont have production. So far we have beeen using vision type 11 and to be honest this type of defect, that placement of TNTA at flank side, happend very seldom. Usually

Yield on 0402 SMT Printed Circuit Board Assemblies

Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS

I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou

China RoHS?? Say it ain't so!!

Electronics Forum | Thu Jan 04 15:27:23 EST 2007 | patrickbruneel

Here it is Steve Here's a (427 page) EPA report on Solders in Electronics: A Life-Cycle Assessment http://www.epa.gov/opptintr/dfe/pubs/solder/lca/lfs-lca-final.pdf If you look at page ES-16/table ES-4 and ES-5 it appears that SAC alloys have a hig

BGA adapter boad?

Electronics Forum | Fri Jan 05 10:15:55 EST 2007 | Cmiller

I have a customer working on a new design of a rather large board that needs to use a micro BGA that will require 8 layers. He needs to use that BGA and it does not come in any other package. He asked me about making the BGA an adapter or daughter bo

Solder paste handing

Electronics Forum | Mon Jan 15 06:18:50 EST 2007 | CL

Good Morning Stephen, 1) Most solder paste manufacturers recommend a 2 hour temperature stabilazation period. Solder paste should not be opened and exposed to ambient air if it is still cold. 2)Manufacturers do not reccomend mixing old and new paste

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