Electronics Forum | Thu Aug 22 22:10:26 EDT 2002 | davef
Ooooow! �Can it be fixed?� Good question. How BAD did you damage it? * Since you are asking this question, I am NOT inspired by the potential that you have the skills to fix the board. Go Jeff Ferry�s site at Circuit Repair Center [If you can�t f
Electronics Forum | Fri Sep 20 20:03:55 EDT 2002 | mjabure
Well chip I ought to leave you guys hanging in the breeze on this one , but here goes. Steve, your assumption that the nozzle is calculated as part of the component body for types 11 & 12 is incorrect. during center test on the 643's one of the par
Electronics Forum | Fri Sep 13 09:16:36 EDT 2002 | bmulcahy
Hi dave, Only back in the forum today to see your query so here goes (1) VIA ,PTH holes -- we found that because the amount of gold being plated is generally less that the amount of HASL that holes can be physically wider. This then (pacticularly o
Electronics Forum | Fri Sep 13 06:18:55 EDT 2002 | yngwie
Here's a long survey....Pls help. 1) What is the general feel for via in pad for upcoming designs? - complete Via in pad - partial encroachment - via partially in pad 2) What are the manufacturing bare PCB's related concerns, issues and possible dr
Electronics Forum | Wed Sep 18 14:58:59 EDT 2002 | Claude_Couture
Just to add my 2 cents on the adjustment of pitch on MPA feeders: True: Panasonic do not make it easy to change the pitch on MPA feeders, the thickness of a metal part is what sets the pitch. My solution: for example, I get a 24mm X 12mm pitch MPA
Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
Electronics Forum | Sat Oct 19 04:49:27 EDT 2002 | shailendra
Hi .. I have read with keen interest on the various replies on your query.. However, the most important thing that seems to be missing in the replies posted is reference to today's business scenario..which calls for a very fast ROI (return on inves
Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper
Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s
Electronics Forum | Fri Nov 01 18:57:32 EST 2002 | slthomas
I guess I just don't see how it would benefit us any. We rarely remove a board from the conveyor unless it's coming out of an oven. And why would you put bare boards on a tray? Why not into a destacker that feeds your line, so only the edges of a
Electronics Forum | Mon Nov 04 15:53:49 EST 2002 | kenBliss
Hi Steve I understand your point, the comments on the thread of which are slightly off of the original posted question but it still is handling. Handling is handling. If you pick up a board from one conveyor just to put on another conveyor that is
