Electronics Forum: (4) (Page 61 of 630)

Re: Misalignment during reflow

Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F

Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed

Re: TCE for Ais

Electronics Forum | Thu Jun 25 15:33:51 EDT 1998 | Earl Moon

Hi there, Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? Appreciated for your help. rgs, chiakl Chiakl, It looks like you are speaki

smt codes

Electronics Forum | Tue Aug 24 23:04:14 EDT 2004 | pdeuel

If this code is on a ceramic cap then it is a 0.1uf cap. We have a conversion charts that list most all codes. Useing the last 2 digets only determine the value. The capatol letters A thru Z are given specfic numerical value. Example A0 is 1.0pf, A1

Fuji CP4&CP6 Placement issues

Electronics Forum | Sun Jan 29 02:33:36 EST 2006 | daxman

Hello all, I work with a company which runs a fairly small SMT department. For now, we have a "main" line consisting of a Fuji CP6-45, and a Fuji IP3, and a proto line which uses a Fuji CP4. We also use Fuji Flexa programming software. The issues

Cu% spec for lead free HASL surface finish

Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef

There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass

Large Area Wire/Wedge Bonder

Electronics Forum | Tue Mar 16 18:36:11 EDT 2010 | janz

Looking for a large area wire ball bonder or > wedge bonder. Must be able to take 4" X 5" panel > and have a bond area of close to 3.5" X 4.4". > Also need 6 to 8 wire per second. K&S no longer > makes one. Panasonic no longer makes one. ASM

0402 stencil design

Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef

You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas

Mirtec programming discussion

Electronics Forum | Fri Nov 05 10:35:18 EDT 2010 | methos1979

This was a great post from another thread here with some tips: Date: November 04, 2010 07:42 PM Author: eadthem Subject: Who has best desktop AOI ? We do almost exclusively SMT parts but for solder with a 45 degree fillet angle use vertical light

Re: SMT/TH machine programming

Electronics Forum | Fri Sep 03 00:17:21 EDT 1999 | JAX

You use MCS computers to transmit programs/data to machines --> MCSs are getting old, so you would like to use F4G or FujiCam just because you could use a standard 486/Pentium --> But you still like your current programming SW (obviously not

Re: Water quality for rinse water

Electronics Forum | Tue Dec 29 23:37:09 EST 1998 | Mike Konrad

James, Most rental DI systems are as follows: Option #1: 2 mixed bed resin tanks: In this case, a 1 M-Ohm light should be installed on the output of tank #1, before tank #2. When the 1 M-Ohm light indicates that the output of the #1 tank is below


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