Electronics Forum: .0

printing speed - paste vs. glue

Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef

Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print

Gluing Quality Issue !!!

Electronics Forum | Tue Nov 03 11:46:52 EST 2009 | davef

Search the finee SMTnet Archives for previous posts on the topic. Here's a clip from on of those posts that may get you started. [snip] * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, availa

YesTech F1 AOI false calls and misses

Electronics Forum | Wed Apr 04 13:33:12 EDT 2012 | rway

We currently have 2 M1 systems. Our false call rate has never been has high as you suggest. There is something wrong with your program and/or inspection algorithms, as you probably already know. You should be somewhere between 1000-1500 vcpmo (fal

X-Ray, inspection voltage, voltage blooming

Electronics Forum | Fri Jan 31 11:45:52 EST 2014 | emeto

Hi, to get better image you will probably need higher voltage(depending on how close you want to look). The closer you get the higher the voltage should be. Here are some tips for machine calibration: 1. Make sure your board is on focus. I don't kn

How important NSMD pads are for the QFN and similar packages?

Electronics Forum | Wed Jul 30 00:47:10 EDT 2014 | matusov

Hello gurus, I am a hardware designer with a small company. We are about to send a new PCB for fabrication. This board uses dozens of tiny QFN, DFN, and similar packages. As a final check I have been going through the datasheets of all these parts t

stencil/printing machines for solder paste

Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam

Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V

DEK Printer File Format

Electronics Forum | Fri Jun 15 01:44:21 EDT 2018 | buckcho

Hello, so i am not sure about the MSSQL. But i think that you have to order the printer feedback function or the closed loop software. Here is what we get in those files, which i think is okay for you: 2018-06-13T10:37:42.11

HIP defect in BGA

Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan

Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr

LGA36 6.5 x 3.5 mm

Electronics Forum | Thu Apr 12 22:54:06 EDT 2007 | mika

conductor on the narrowest place ~0.07mm we suggest them to go for a PCB solder pad down to 0.30mm. The Conductor width is: 0.2mm The current problem they are having now is that there will be a problem with 14V to narrow the conductor to the narrowe

Gold Surface Finish on PCB's

Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef

Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th


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